20 Apr2026
India's First 3D Chip Packaging Unit Foundation Laid in Bhubaneswar
The foundation stone for India's first advanced 3D chip packaging unit has been laid at Info Valley in Bhubaneswar. This project, aligned with the Atmanirbhar Bharat vision, aims to position Odisha as a key hub in next-generation semiconductor infrastructure, focusing on advanced 3D glass-based packaging technologies crucial for AI and communication systems.
Source: The New Indian Express